Utilizing a state-of-the-art tool set, Innovative III-V Solutions develops customer-specific process flows for a wide range of applications. Available processes include:

  • Metal Deposition - Evaporation, Sputtering, Electroplating
  • Thin Film Deposition - PECVD, ALD, Thermal Oxidation
  • Wet Etching - InP, GaAs, Si
  • Dry Etching - DRIE, ICP, RIE
  • Photolithography - DUV, i-line, E-beam
  • Wafer Bonding - Die-to-Wafer, Wafer-to-Wafer
  • Electrical Characterization
  • Metrology & Failure Analysis - SEM, AFM, FIB, TEM, SIMS, plus more
  • Packaging and Test Prep - Die Singulation, Optical Facet Polishing