Utilizing a state-of-the-art tool set, Innovative III-V Solutions develops customer-specific process flows for a wide range of applications. Available processes include:

• Metal Deposition - Evaporation, Sputtering, Electroplating

• Thin Film Deposition - PECVD, ALD, Thermal Oxidation

• Wet Etching - InP, GaAs, Si

• Dry Etching - DRIE, ICP, RIE

• Photolithography - DUV, i-line, E-beam, contact

• Wafer Bonding - Die-to-Wafer, Wafer-to-Wafer

• Electrical Characterization

• Metrology & Failure Analysis - SEM, AFM, FIB, TEM, SIMS, plus more

• Packaging and Test Prep - Die Singulation, Optical Facet Polishing